Multiple pillar liquid heater

ABSTRACT

Devices, systems, and apparatuses for heating a liquid are disclosed herein. In one embodiment, a heater includes a base comprising a generally planar surface and at least two heater pillars and a sensor pillar configured on the base. The at least two heater pillars each comprise heating elements. The sensor pillar includes a thermal sensor. A mixing element is configured on the generally planar surface of the base and is coupled to a mixing motor. When powered, the heating elements of the heater pillars are configured to generate heat and the mixing motor is configured to cause the mixing element to rotate.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation of U.S. patent applicationSer. No. 16/674,877, filed Nov. 5, 2019, which claims priority to andthe benefit of U.S. Provisional Patent Application No. 62/755,795,entitled “PROPULSION HEATER,” filed Nov. 5, 2018, and is acontinuation-in-part of and claims priority to and the benefit of U.S.patent application Ser. No. 16/040,523, filed Jul. 19, 2018, entitled“LIQUID FOOD ITEM PRESERVATION AND PREPARATION,” which claims priorityto U.S. Provisional Patent Application No. 62/534,641, filed Jul. 19,2017, entitled “APPARATUS FOR STORING AND HEATING A LIQUID,” thedisclosures of which are incorporated herein by reference in theirentirety.

BACKGROUND

Some liquids need heating for their use but can become damaged orunusable if heated to high temperatures. For instance, pumped breastmilkis often heated prior to feeding, but can, if heated excessively,degrade in nutrient quality, be pasteurized of natural bacteria, and/orscald a feeding baby. A common heating practice includes submerging abreastmilk-filled bottle in a water-filled pot heated on the stove.Heating breastmilk in this way is time-consuming and can often beimprecise, causing dangerous or damaging hot spots to develop in theexpressed breastmilk.

SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter.

Several embodiments of the disclosed technology can quickly andefficiently heat a liquid, such as expressed breastmilk, to a targettemperature without excessively heating the liquid. Several embodimentsof the disclosed technology can evenly distribute heat throughout aliquid being heated during the heating process, thereby minimizingtemperature gradients within the liquid and potential hotspots. Severalembodiments of the disclosed technology can quickly and efficiently heata liquid from an initial temperature to a target temperature. Severalembodiments of the disclosed technology can be configured integratedwithin a suitable liquid holding vessel, such as an insulated bottle,food-safe cup or bottle, metal bottle, hot water kettle, hot water tank,or open top liquid container. U.S. patent application Ser. No.16/040,523, filed Jul. 19, 2018, entitled “LIQUID FOOD ITEM PRESERVATIONAND PREPARATION,” which is incorporated herein by reference in itsentirety and which the present application claims priority to and thebenefit of, discloses a suitable liquid holding vessel comprising aliquid food item preparation device, in accordance with embodiments ofthe present disclosure.

Several embodiments of the disclosed technology comprise a propulsionheater comprising a base having a liquid-facing side, at least twoheater pillars and a sensor pillar configured on the base and extendingon the liquid-facing side away from the base, and a mixing componentcomprising a mixing element configured on the liquid-facing side of thebase. Each of the at least two heater pillars can be configured tocomprise a heating element configured to transfer heat to a liquid in aliquid-holding volume. In some embodiments, the heating elementscomprise respective resistive wire coils. The sensor pillar can beconfigured to comprise at least one thermal sensor. The mixing elementcan be configured to comprise a stirrer. The mixing component cancomprise a mixer motor configured to cause the mixing element to rotate.In some embodiments, the propulsion heater can be configured to comprisea volume sensor.

In some embodiments, the propulsion heater can be configured in a vesselcomprising a liquid-holding volume. In some embodiments, the propulsionheater comprises a computing system that can be configured to applypower, via a power source, to the heating elements of the at least twoheater pillars to cause the heater pillars to generate heat. Thecomputing system can be further configured to apply power, via the powersource, to the mixer motor to cause the mixing element to rotate. Thecomputing system can be configured to receive thermal measurements fromthe at least one thermal sensor to determine a temperature of a liquidin the liquid-holding volume. The computing system can be configured toreceive volume measurements from the volume sensor. In some embodiments,the propulsion heater can be configured to heat a liquid in theliquid-holding volume to a target temperature, and once the targettemperature is reached, to cease heating the liquid.

Several embodiments of the disclosed technology may be integrated at anyof various, suitable locations of a container. Several embodiments ofthe disclosed technology can be configured at a center bottom of acontainer. Several embodiments of the disclosed technology can beconfigured to transfer heat efficiently by maximizing surface area incontact with the liquid.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a propulsion heater in accordance withembodiments of the disclosed technology.

FIG. 2 is a top plan view of a propulsion heater in accordance withembodiments of the disclosed technology.

FIG. 3 is a schematic cross-sectional side view of a propulsion heaterin accordance with embodiments of the disclosed technology.

FIG. 4A is a schematic cutaway perspective view of a propulsion heaterconfigured in a vessel showing internal components in accordance withembodiments of the disclosed technology.

FIG. 4B is a schematic cutaway top plan view of a propulsion heaterconfigured in a vessel in accordance with embodiments of the disclosedtechnology.

FIG. 5 is a schematic cutaway side plan view of a propulsion heaterconfigured for heating a liquid in a vessel in accordance withembodiments of the disclosed technology.

FIG. 6 is a schematic perspective view of a suspended propulsion heaterconfigured for heating a liquid in a liquid-holding volume of a vesselin accordance with embodiments of the disclosed technology.

FIG. 7 is a schematic top plan view of a suspended propulsion heaterconfigured on a vessel for heating a liquid in a liquid-holding volumeof the vessel in accordance with embodiments of the disclosedtechnology.

FIG. 8 is a schematic perspective view of a submergible propulsionheater in accordance with embodiments of the disclosed technology.

FIG. 9 is a computing device suitable for certain components of thecomputing system in FIGS. 1-8 .

DETAILED DESCRIPTION

Certain embodiments of apparatuses, systems, devices, and components(referred to generally herein as a “propulsion heater”) for heating aliquid are described below. In the following description, specificdetails of components are included to provide a thorough understandingof certain embodiments of the disclosed technology. A person skilled inthe relevant art will also understand that the technology can haveadditional embodiments. The technology can also be practiced withoutseveral of the details of the embodiments described below with referenceto FIGS. 1-9 .

As used herein, the term “target temperature” generally refers to atemperature to which a liquid is to be heated. The target temperaturefor a liquid may comprise a temperature threshold.

FIG. 1 is a perspective view of a propulsion heater 100 configured inaccordance with embodiments of the disclosed technology. FIG. 1 showsthe propulsion heater 100 including a heater base 102, heater pillars104 a-d, a sensor pillar 106, a mixing element 108, and an electronicshousing 110. In some embodiments, the propulsion heater 100 can beconfigured within a vessel, such as at a base of an internal volume of abottle, as shown in FIG. 4A. In such an embodiment, the heater pillars104 a-d can be configured to transfer heat to a liquid in the internalvolume, the sensor pillar 106 can be configured to detect a temperatureof the liquid in the internal volume, and the mixing element 108 can beconfigured to agitate the liquid in the volume. As an example, U.S.patent application Ser. No. 16/040,523, filed Jul. 19, 2018, entitled“LIQUID FOOD ITEM PRESERVATION AND PREPARATION,” which is incorporatedherein by reference in its entirety and which the present applicationclaims priority to and the benefit of, discloses a vessel comprising acontainer that can be configured to comprise the propulsion heater 100.

The propulsion heater 100 can be configured to transfer heat to a liquidvia the heater pillars 104 a-d. The heater pillars 104 a-d can beconfigured to comprise respective heating elements. For example, each ofthe heater pillars 104 a-d can be configured to comprise a resistivecoil wire (not shown) configured to generate heat.

The sensor pillar 106 can be configured to detect a temperature. Thesensor pillar 106 can be configured to comprise at least one thermalsensor (not shown) configured to detect a temperature. For example, thethermal sensor can comprise a thermometer.

The mixing element 108 can be configured to rotate. Rotation of themixing element 108 can agitate a liquid in an internal volume of avessel comprising the propulsion heater 100. For example, in someembodiments, the mixing element 108 can comprise a stirrer configuredcoupled to a mixer motor (not shown) that is configured to rotate thestirrer about an axis of rotation. As shown in FIG. 1 , the mixingelement 108 can comprise a stirrer having a pill shape. In someembodiments, the electronics housing 110 can be configured to includethe mixer motor (not shown).

The sensor pillar 106 and heater pillars 104 a-d can be configured toemanate from the heater base 102. In some embodiments, the sensor pillar106 and heater pillars 104 a-d are configured to be substantiallyorthogonal to the heater base 102. For example, as shown in FIG. 1 , thesensor pillar 106 and heater pillars 104 a-d can be configured tocomprise cylinders originating at the heater base 102 and protrudingaway from the heater base 102. In some embodiments, the heater pillars104 a-d and the sensor pillar 106 can be configured to each comprise apillar base 154 that slopes outward from the pillar and joins the heaterbase 102.

The sensor pillar 106 and heater pillars 104 a-d can be configured in anarrangement that promotes even heating of a liquid in a liquid-holdingvolume. For example, FIG. 2 is a top plan view of the propulsion heater100. As shown in FIG. 2 , in some embodiments, the sensor pillar 106 andheater pillars 104 a-d can be configured equidistant apart, formingcorners of a pentagon arrangement, and the mixing element 108 can beconfigured to rotate about a center of rotation that is at a center ofthe pentagon arrangement. The sensor pillar 106 and heater pillars 104a-d can be configured at locations that do not obstruct the rotation ofthe mixing element 108.

In some embodiments, the sensor pillar 106 and heater pillars 104 a-dcan be configured in a different arrangement from the arrangement shownin FIGS. 1-2 . For example, in some embodiments, the heating pillars 104a-d can be arranged in a square arrangement, and the sensor pillar 106can be arranged between two of the heating pillars 104 a-d. In otherembodiments, the propulsion heater 100 can be configured to have more orfewer heater pillars than the four heater pillars 104 a-d. For example,in some embodiments, the propulsion heater 100 can be configured tocomprise five heater pillars and a sensor pillar, the heater pillars andthe sensor pillar arranged in a hexagon arrangement.

FIG. 3 is a schematic cross-sectional side view of the propulsion heater100 taken along the plane indicated by line A-A in FIG. 2 . FIG. 3 showsthe heater pillar 104 d and the sensor pillar 106 emanating from theheater base 102. Heater pillars 104 a-c can be constructed as discussedherein with respect to heater pillar 104 d.

The heater pillar 104 d, heater base 102, and sensor pillar 106 can beconfigured to comprise a surface material 142 configured to contact aliquid being heated by the propulsion heater 100. In some embodiments,as shown in FIG. 3 , the surface material 142 can also comprise theelectronics housing 110. In some embodiments, the surface material 142can comprise a food-safe material. In some embodiments, the surfacematerial 142 can comprise 304 stainless steel.

The surface material 142 can be manufactured to comprise the heaterpillars 104 a-d, heater base 102, sensor pillar 106, and electronicshousing in various ways. In some embodiments, a single sheet of surfacematerial 142 can be formed to comprise the heater pillars 104 a-d,heater base 102, and sensor pillar 106. For example, in someembodiments, a sheet of stainless steel comprising the surface material142 can be pressure formed to comprise the heater pillars 104 a-d,heater base 102, and sensor pillar 106. In some embodiments, the surfacematerial 142 comprising the heater pillars 104 a-d, heater base 102,sensor pillar 106, and electronics housing 110 can be formed by joiningtwo or more pieces of the surface material 142 together. For example, insome embodiments, the heater base 102, heater pillars 104 a-d, sensorpillar 106, and electronics housing 110 can each be independently formedby stamping and joined together by welding into a single seamless formusing such methods as laser welding, resistive welding, ultrasonicwelding, or tungsten inert gas (TIG) welding.

The heater pillar 104 d is configured to comprise a heating element. Insome embodiments, as shown in FIG. 3 , the heating element can comprisea resistive wire coil 146 wrapped around an electrically insulative core144. For example, the resistive wire coil 146 can be configured tocomprise a resistance heating metal, semi-meal, or alloy, such asnichrome. The resistive wire coil 146 can be configured to rapidly heatto a temperature proportional to a voltage applied across the resistivewire coil 146. In some embodiments, the electrically insulative core 144can be configured to be thermally conductive. In some embodiments, theelectrically insulative core 144 can be configured to comprise amagnesium oxide ceramic.

In some embodiments, the surface material 142 comprising the heaterpillar 104 d can be initially formed to comprise a hollow tube of thesurface material 142. Subsequently, the heating element can beconfigured in the hollow tube of the surface material 142 comprising theheater pillar 104 d. For example, the heating element comprising theresistive wire coil 146 wrapped around the electrically insulative core144 can be inserted in the hollow tube of the surface material 142comprising the heater pillar 104 d. The resistive wire coil 146 can beelectrically isolated from the surface material 142 by an electricallyinsulative thermal compound, such as magnesium oxide. For example, afterinserting the resistive wire coil 146 wrapped around the electricallyinsulative core 144 into the hollow tube of the surface material 142comprising the heater pillar 104 d, an electrically insulative packinglayer 148 comprising magnesium oxide powder can be packed between thewire coil 146 and the surface material 142. The electrically insulativepacking layer 148 can be configured to permeate and fill physical gapsbetween coils of the resistive wire coil 146 and between the resistivewire coil 146 and surface material 142 comprising the heater pillar 104d. For example, a packing machine can be used to pack the magnesiumoxide powder to form the insulative packing layer 148. In someembodiments, the electrically insulative packing layer 148 can beconfigured to transfer heat from the resistive wire coil 146 to thesurface material 142, which can be configured to transfer the heat to aliquid being heated in liquid holding volume in which the propulsionheater 100 is disposed.

In some embodiments, as shown in FIG. 3 , the heater pillar 104 d can beconfigured to include a pillar cap 150. The pillar cap 150 can beconfigured between the electrically insulative core 144 and the surfacematerial 142 of the heater pillar 104 d. In some embodiments, as shownin FIG. 3 , the pillar cap 150 can comprise an electrically isolating,thermally conductive material. For example, in some embodiments, theelectrically isolating, thermally conductive material of the pillar cap150 can comprise a ceramic, such as a magnesium oxide ceramic. In someembodiments, the electrically isolating, thermally conductive cap can bemanufactured by packing the electrically isolating, thermally conductivematerial comprising the cap in the surface material 142 comprising theheater pillar 104 d prior to introducing the resistive wire coil 146 andelectrically insulative core 144 in the heater pillar 104 d. In suchembodiments, the pillar cap 150 can be configured to electricallyisolate the resistive wire coil 146 from the surface material 142 of theheater pillar 104 d. In such embodiments, as shown in FIG. 3 , theelectrically insulative core 144 can be configured comprising at leastone hollow tunnel 145 along its length, from the pillar cap 150 throughthe heater base 102. A first lead 147 a of the resistive wire coil 146can be electrically coupled to the printed circuit board 126 and a powersource (not shown) via heater connector 130 b. A second lead 147 b ofthe resistive wire coil 146 can be electrically connected to the printedcircuit board 126 via heater connector 130 a. As shown in FIG. 3 ,heater connector 130 a can be routed through the hollow tunnel 145 ofthe electrically insulative core 144 for termination at the printedcircuit board 126. The heater connectors 130 a-b can comprise copper andcan be crimped to the leads of the resistive wire coil 146.

In other embodiments, the pillar cap 150 can be configured to comprise amaterial that is electrically conductive, and the resistive wire coil146 can be configured to be electrically coupled with the pillar cap150. For example, the pillar cap 150 can be configured to ground theresistive wire coil 146 to the surface material 142 comprising theheater pillar 104 d. In such embodiments, the pillar cap 150 can beconfigured to terminate the second lead 147 b of the resistive wire coil146. In such embodiments, the pillar cap 150 can be constructed of ametal, such as copper, or a semi-metal material, such as graphene.

The sensor pillar 106 is configured to comprise at least one thermalsensor 107 a-b. As shown in FIG. 3 , in some embodiments, the sensorpillar 106 can be configured to comprise at least a first thermal sensor107 a and a second thermal sensor 107 b, the first thermal sensor 107 aconfigured at a different height than the second thermal sensor 107 b onthe sensor pillar 106. For example, as shown in FIG. 3 , the firstthermal sensor 107 a is configured at a top 152 of the sensor pillar 106and the second thermal sensor 107 b is configured near the pillar base154 of the sensor pillar 106. Accordingly, the thermal sensors 107 a-bcan be configured to detect the temperature at two depths within aliquid being heated. In some embodiments, additional thermal sensors canbe configured on the sensor pillar 106. In some embodiments, as shown inFIG. 3 , thermal sensors 107 a-b can be positioned 180 degrees from oneanother within the sensor pillar 106. In some embodiments, thermalsensors 107 a-b can be positioned at varying degrees from one anotherwithin the sensor pillar 106.

The thermal sensors 107 a-b can be configured on an internal side 156 ofthe surface layer 142 of the sensor pillar 106. The thermal sensors 107a-b can be adhered to the internal side 156 of the surface layer 142 ofthe sensor pillar 106 via a thermally conductive adhesive. The thermalsensors 107 a-b can be configured electrically coupled via the sensorconnectors (not shown) with the printed circuit board 126.

FIG. 4A shows a schematic perspective cutaway view of the propulsionheater 100 configured in a vessel 114. The vessel 114 is configured toinclude a liquid holding volume 117. The vessel 114 comprises an innershell 132 a and an outer shell 132 b.

FIG. 4A shows the cutaway view of the vessel 114 and propulsion heater100, including a cutaway of the inner shell 132 a and outer shell 132 bof the vessel 114, a wall of the electronics housing 110, and the heaterbase 102. Also shown cutaway are portions of the surface layer of thesensor pillar 106, showing the thermal sensors 107 a-b. Not shown areheater pillars 104 a-b, shown in FIGS. 1 and 2 , which are configured atthe cut portion of the heater base 102. In some embodiments, theelectronics housing 110 can be defined, at least in part, by at leastthe inner shell 132 a of the vessel 114. FIG. 4A shows an internalvolume of the electronics housing 110. The view shown in FIG. 4A showsthe heater pillars 104 c-d and the sensor pillar 106 configuredemanating from the heater base 102 in the liquid holding volume 117.FIG. 4A also shows the mixing element 108 configured on the heater base102 in the liquid holding volume 117.

As shown in FIG. 4A, the electronics housing 110 can be configured tocomprise a mixer motor 120, a volume sensor 124, and the printed circuitboard 126, among other components. In some embodiments, as shown in FIG.4A, the printed circuit board 126 comprises a computing system 300comprising a processor and memory. The electronics housing 110 can beconfigured to comprise heater connectors 130, that electrically connectthe respective heating elements of heater pillars 104 a-d and theprinted circuit board 126, which is electrically coupled with a powersource (not shown). The computing system 300 can be configured tocontrol power being supplied to the heater pillars 104 a-d via theheater connectors 130. The electronics housing 110 can also comprisesensor connectors 128 configured to electrically couple the thermalsensors 107 a-b and the printed circuit board 126. For example, in someimplementations, the sensor connectors 128 can be configured tocommunicate thermal measurements sensed by the thermal sensors 107 a-bto the computing system 300 of the printed circuit board 126.

The mixer motor 120 is configured to exert a force on the mixing element108 to cause the mixing element 108 to rotate. The mixing element 108can be configured to comprise a magnet. For example, in someembodiments, the mixing element 108 comprises a neodymium magnet. Themixer motor 120 can be configured to comprise a motor magnet 116 that ismagnetically coupled to the mixing element 108. The mixer motor 120 canbe configured to force the motor magnet 116 to rotate, and the rotationof the motor magnet 116 can cause the mixing element 108 to rotate aswell.

In some embodiments, the mixer motor 120 can be configured to comprise arotating top 122. The rotating top 122 of the mixer motor 120 can beconfigured to comprise the motor magnet 116. The motor magnet can beconfigured attached to the rotating top 122 of the mixer motor 120. Insome embodiments, the motor magnet 116 can be adhered to the rotatingtop 122 of the mixer motor 120. For example, as shown in FIG. 3 , themotor magnet 116 can be attached to the rotating top 122 via magnetattachments 118. The magnet attachments 118 can comprise, for example,plastic clips.

The mixer motor 120 can be configured to force the rotating top 122 torotate. For example, in some embodiments, the mixer motor 120 cancomprise a Brushless DC electric motor or a Ball Bearing DC electricmotor. The mixer motor 120 can be configured to be electrically coupledto the computing system 300 of the printed circuit board 126. Thecomputing system 300 can be configured to control the mixer motor 120and power the mixer motor 120 using the power supply (not shown).

The volume sensor 124 can be configured within the electronics housing110 to a housing side (not shown) of the heater base 102. The volumesensor 124 can be configured to capture measurements that can be usedfor calculating a volume of a liquid in the liquid holding volume 117.The electronics housing 110 can comprise volume sensor connectors (notshown) that can be electrically coupled with the computing system 300 ofthe printed circuit board 126. In some embodiments, the volume sensor124 can comprise an ultrasonic liquid volume sensor.

FIG. 4B shows a schematic top cutaway plan view of the vessel 114comprising the propulsion heater 100, showing the heater base 102 andthe vessel 114 cut, as shown in FIG. 3A. FIG. 3B shows the sensor pillar106 and heater pillars 104 c-d, and heater pillars 104 a-b are cutaway.FIG. 3B also shows the printed circuit board 126 and the volume sensor124.

FIG. 4B also shows the mixing element 108, which is configured on theheater base 102 within the liquid holding volume 117 of the vessel 114.The mixing element 108 is configured in a vertical plane with the motormagnet (not shown). FIG. 4B shows the rotating top 122 of the mixermotor 120. FIG. 4B also shows the magnet attachments 118, which can beconfigured to attach the motor magnet (not shown) and the rotating top122 of the mixer motor. FIG. 4B also shows the computing system 300.

FIG. 5 shows a schematic cutaway side plan view of the propulsion heater100 configured in the vessel 114, including a power source comprising abattery pack 162. In some embodiments, the battery pack 162 can comprisea battery and battery controller. The battery pack 162 can be configuredto power the computing system 300, the heater pillars 104 a-d, and mixermotor 120, among other components. A liquid, such as human breast milk,can be added to the liquid holding volume 117 via an orifice 119 of theliquid holding volume 117. The liquid can be heated by the propulsionheater 100 and agitated by the mixing element 108.

FIG. 5 shows the heater pillars 104 a-b and the sensor pillar 106. Theheater pillars 104 c-d are blocked from view in FIG. 5 by heater pillars104 a-b. As shown in FIG. 5 , heater pillar 104 a comprises a heatingelement 105 a and heater pillar 104 b comprises a heating element 105 b.Although not shown, heater pillars 104 c-d include similar heatingelements as heating elements 105 a-b. FIG. 5 also shows the mixingelement 108, motor magnet 116, volume sensor 124, and printed circuitboard 126. The printed circuit board 126 can be configured electricallyconnected with the volume sensor 124 via volume sensor connector 131,the heating elements 105 a-b of the heater pillars 104 a-b via heaterconnectors 130 a-b, and the thermal sensors 107 a-b via sensorconnectors 128. The printed circuit board 126 can further beelectrically connected with the mixer motor 120 and the computing system300, and with the battery pack 162 via battery connectors 135. Theprinted circuit board 126 can be configured mounted within theelectronics housing 110.

The computing system 300 can be configured to control, modulate, and/orregulate power to the respective heating elements of the heater pillars104 a-d. In some embodiments, the computing system 300 can be configuredto receive input from thermal sensors 107 a-b and volume sensor 124. Insome embodiments, the computing system 300 can be configured to detectand/or receive input related to the heating elements 105 a-b of theheater pillars 104 a-b. For example, in some embodiments, the computingsystem 300 can detect a current drawn by the heating elements 105 a-b ofthe heater pillars 104 a-b. In some embodiments, the computing system300 can be configured to supply power selectively to fewer than all theheating elements of the heating pillars 104 a-d. For example, in someembodiments, the computing system 300 can be configured to supply powerselectively to the heating element 105 b of heating pillar 104 b and notthe heating element 105 a of heating pillar 104 a, or the heatingelements of heater pillars 104 c and 104 d.

In some embodiments, the propulsion heater 100 and/or the vessel 114 cancomprise an input mechanism (not shown) electrically coupled to thecomputing system 300, the input mechanism configured for receiving inputfrom a user. In some embodiments, the input mechanism can comprise abutton, a touchscreen display, a switch, or the like. In someembodiments, the computing system 300 can be configured to modulatepower to the heating elements of the heater pillars 104 a-d (includingheating elements 105 a-b) based at least in part on thermal and/orvolume sensor input. In some embodiments, the computing system 300 canbe configured to modulate power to the heating elements of the heaterpillars 104 a-d (including heating elements 105 a-b) based at least inpart on input from at least one heating element of the heater pillars104 a-d. In some embodiments, the computing system 300 can be configuredto modulate, turn-on, or shut-off power to the heating elements of theheater pillars 104 a-d (including heating elements 105 a-b) based atleast in part on user input, such as input from a button, a touchscreen,a switch, or the like.

In some embodiments, the propulsion heater 100 or the vessel 114 can beconfigured to include a display, such as an LED indicator, an LED array,an LCD display, an OLED display, or the like. In some embodiments, thecomputing system 300 can be configured to output device and componentinformation to a display.

In some embodiments, the heating elements of the heater pillars 104 a-d(including heating elements 105 a-b) can be controlled by anenvironmental switch, such as a temperature switch or liquid volumeswitch. For example, the propulsion heater 100 can be configured toswitch the heating elements 105 a-b off in response to receiving inputfrom the thermal sensors 107 a-b indicating that a target temperaturehas been measured. In some embodiments, the heating elements of theheater pillars 104 a-d (including heating elements 105 a-b) can operateat a static duty cycle. In some embodiments, the heating elements of theheater pillars 104 a-d (including heating elements 105 a-b) can beconfigured to operate at a calculated, dynamic duty cycle. In someembodiments, the heating elements of the heater pillars 104 a-d(including heating elements 105 a-b) can be controlled by a user, basedat least in part on receiving input from the user, such as detecting apress of a button configured on the propulsion heater 100 or vessel 114.In some embodiments, the heating elements of the heater pillars 104 a-d(including heating elements 105 a-b) can be controlled by an externalcontroller. For example, in some embodiments, the external controllercan comprise the computing system 300 configured external to thepropulsion heater 100 and vessel 114.

In some embodiments, the propulsion heater 100 can be configured tocalculate and apply a voltage across the heating elements (includingheating elements 105 a-b) of the heating pillars 104 a-d based at leastin part on input received from the thermal sensors 107 a-b and/or thevolume sensor 124. In some embodiments, the propulsion heater 100 can beconfigured to calculate and apply a power to the mixing motor 120 basedat least in part on input received from the thermal sensors 107 a-band/or the volume sensor 124. In some embodiments, the propulsion heater100 can be configured as a permanent fixture in a container, such as adouble-layer vacuum insulated container. In some embodiments, thepropulsion heater 100 can be configured as a removable fixture in acontainer, such as a hot water kettle. In some embodiments, thepropulsion heater 100 can be configured to comprise a display fordisplaying a user interface and a button for receiving user input. Insuch an embodiment, the propulsion heater 100 can be configured toreceive user input comprising an instruction to heat a liquid in aliquid-holding volume, in response to receiving the instruction, heatthe liquid in the liquid holding volume to a target temperature. In someembodiments, the propulsion heater 100 can be configured such that powerto the heating elements (including heating elements 105 a-b) of heaterpillars 104 a-d and power to the mixing motor 120 is controlled andcalculated by an external controller and power supply using, at least inpart, measurements received from the thermal sensors 107 a-b and/or thevolume sensor 124.

A benefit of the disclosed apparatus includes quickly heating a liquidto a target temperature while minimizing hot-spots, thermal gradients,and excessive temperatures in the liquid. In some embodiments, thecomputing system 300 of the propulsion heater 100 can be configured topower the mixing motor 120 such that the mixing element 108 revolves ata determined revolutions per minute (RPM). In some embodiments, an RPMfor the mixing element 108 can be determined based at least in part onthe temperature measurements received from the thermal sensors 107 a-bof the sensor pillar 106 and/or volume measurements received from thevolume sensor 124. In some embodiments, an RPM of the mixing element 108can be determined based at least in part on a type of liquid in theliquid holding volume 117.

In some embodiments, the computing system 300 can be configured tomodulate power to the mixing motor 120 based at least in part on inputfrom the thermal sensors 107 a-b and/or the volume sensor 124. In someembodiments, the computing system 300 can be configured to modulatepower to the mixing motor 120 based at least in part on the currentdrawn by the mixing motor 120. In some embodiments, the computing system300 can be configured to modulate, turn-on, or shut-off power to themixing motor 120 based at least in part on user input received via, forexample, a button, a touchscreen, a switch, or the like.

In some embodiments, the mixing motor 120 can be controlled by anenvironmental switch, such as a temperature switch or liquid volumeswitch. In some embodiments, the mixing motor 120 can be configured tooperate at a static duty cycle. In some embodiments, the mixing motor120 can be configured to operate at a calculated, dynamic duty cycle. Insome embodiments, the mixing motor 120 can be configured to becontrolled by the user based on user input, received, for example, via abutton press or via a touchscreen. In some embodiments, the mixingelement 108 can comprise a magnet coated in a food-safe material, suchas borosilicate glass or Teflon. In some embodiments, the mixing motor120 can be anchored to the printed circuit board 126 via a componentchassis. In some embodiments, the mixing motor 120 can be directlyanchored to the printed circuit board 126 via, for example, one or morescrew/screw-post or screw/nut combination. The mixing element 108 can beconfigured to rotate and cause liquid in the liquid holding volume 117to circulate between the heater pillars 104 a-d and the sensor pillar106. In some embodiments, as the mixing element 108 spins within theliquid holding volume 117, it can cause a liquid in the liquid holdingvolume 117 to mix.

The thermal sensors 107 a-b of the sensor pillar 106 can be configuredto transmit digital data corresponding to or representing temperaturevalues to the computing system 300. In some embodiments, the thermalsensors 107 a-b can be configured to transmit analog data, such asvoltage and resistivity corresponding to temperature values to thecomputing system 300. In some embodiments, the thermal sensors 107 a-bcan be configured to transmit real-time temperature data to thecomputing system 300. In some embodiments, the thermal sensors 107 a-bcan be configured to send sensed liquid temperature data at presetintervals. In some embodiments, the thermal sensors 107 a-b can beconfigured to send an interrupt signal to computer system 300 when apredetermined liquid temperature in the liquid holding volume 117 issensed. In some embodiments, the thermal sensors 107 a-b can beconfigured as a binary temperature switch whose value, which may bedigital or analog data, only changes when a predetermined liquidtemperature is sensed.

In some embodiments, the volume sensor 124 can be configured to sendreal-time volume data to the computing system 300. In some embodiments,the volume sensor 124 can comprise an ultrasonic fluid level sensor. Insome embodiments, the volume sensor 124 can comprise a resistive fluidlevel sensor. In some embodiments, the volume sensor 124 can comprise aninfrared fluid level sensor. In some embodiments, the volume sensor 124can comprise a capacitive fluid level sensor. In some embodiments, thevolume sensor 124 can be configured to transmit digital datacorresponding to or representing volume values in the liquid holdingvolume 117 to the computing system 300. In some embodiments, the volumesensor 124 can be configured to send analog data, such as voltage andresistivity corresponding to liquid volume values in the liquid holdingvolume 117 to the computing system 300. In some embodiments, the volumesensor 124 can be configured to send sensed liquid volume data at presetintervals. In some embodiments, the volume sensor 124 can be configuredto signal an interrupt to the computing system 300 when a predeterminedliquid volume is sensed. In some embodiments, the volume sensor 124 canbe configured as a binary switch whose value, which may be digital oranalog data, only changes when a predetermined volume is sensed.

In some embodiments, the computing system 300 can be configured tomodulate power from the power source to the mixing motor 120, and thuscontrol the velocity of rotation of the mixing element 108, based oninputs from the thermal sensors 107 a-b and volume sensor 124.

In some embodiments, the computing system 300 can be configured toactivate or deactivate the mixer motor 120 to a preset velocity based atleast in part on inputs from the thermal sensors 107 a-b. In someembodiments, the computing system 300 can be configured to eitheractivate or deactivate the mixing motor 120 based at least in part oninputs from the thermal sensors 107 a-b and volume sensor 124.

In some embodiments, the mixing motor 120 may be controlled bytemperature sensors 107 a-b. In some embodiments, the mixing motor 120can operate at a static velocity. In some embodiments, the mixing motor120 can be configured to operate at a variable velocity.

In some embodiments, the propulsion heater 100 can be configured tooperate from a persistent power source, such as an AC to DC powersupply. In some embodiments, the propulsion heater 100 can be configuredto operate from a finite power source, such as a battery.

In some embodiments, the propulsion heater 100 can be configured to becontrolled by an external controller. In some embodiments, thepropulsion heater 100 can be configured to receive power suppliedvis-à-vis an external controller. In some embodiments of the propulsionheater 100, an external controller can be configured to deliver power tothe components of a specific propulsion heater 100, separately andindependently (e.g., power the heater pillars but not the motor). Insome embodiments of the propulsion heater 100, an external controllermechanism can accept data input from at least one propulsion heater 100.

In some embodiments, an external controller may control the heatingelements of heater pillars 104 a-d of a specific propulsion heater of anarray of propulsion heaters given dynamic input data from thatpropulsion heater including, for example, temperature data, volume data,and power consumption data. In some embodiments, an external controllermay control the mixing device 120 of a specific propulsion heater of anarray of propulsion heaters given dynamic input data from thatpropulsion heater including, for example, temperature data, volume data,and power consumption data.

In some embodiments, an external controller may itself send, switch, andmodulate power to a specific component, such as a heating element ormixing motor within a specific propulsion heater of an array ofpropulsion heaters. In some embodiments, an external controller mayremotely modulate the power switching circuit for a specific component,such as a heating element or mixing motor within a specific propulsionheater.

The propulsion heater can be configured for portability and ease of usewith different vessel configurations. At times, a user may wish tosuspend the propulsion heater from a top of a liquid-holding vessel whenthe bottom of the liquid-holding vessel is inaccessible, uneven, orobstructed. For such cases, the propulsion heater can be configured sothat is can suspend itself from the top opening of a liquid-holdingvessel with its heating pillars, sensors, and mixer device immersed inthe liquid.

FIG. 6 shows a schematic perspective view of a suspended propulsionheater 200 configured for being suspended at a top opening of a vessel,according to some implementations. In some embodiments, the suspendedpropulsion heater 200 can be configured with at least one insulated arm202 that stands erect and perpendicular to an electronics housing 204.The electronics housing 204 can be configured as a waterproof housingfor suspended propulsion heater electronic components and interfaces,such as printed circuit board (not shown), computing system (not shown),mixer motor (not shown), volume sensor (not shown), motor magnet (notshown), magnet attachment (not shown), connectors (not shown), otherelectronics (not shown), and a battery (not shown). The insulated arm202 can be further configured with a perpendicularly attached insulatedhandle 206 at the end opposite the electronics housing, which a user canhold to position, reposition, and place the suspended propulsion heater200. The insulated handle 206, insulated arm 202, and electronicshousing 204 can also be configured as a channel for routing power wiring214 from an external power source 212, such as a DC power supply. Theinsulated handle 206 can comprise a button 218 which can be engaged by auser to commence heating by the suspended propulsion heater 200. In someembodiments, the insulated handle 206 can comprise a display 219.

In some embodiments, the suspended propulsion heater can also beconfigured with at least two adjustable, telescoping support beams 208.In some embodiments, the telescoping support beams 208 are positioned atequal distances and angles relative to one another (e.g. zero and 180degrees). In some embodiments, the telescoping support beams 208 extendoutwards from a center origin of the electronics housing 204. In someembodiments, the support beams 208 can comprise telescoping sectionsthat can extend end-to-end or collapse into one another for stowageinside or against the suspended propulsion heater 200 electronicshousing 204. In some embodiments, the support beams can comprise concavehooks 210 at the end farthest from the electronics housing 204. In someembodiments, the telescoping support beams 208 and hooks 210 can beconfigured to extend from the electronics housing 204 and align with thelip or rim of the liquid vessel. In some embodiments, the telescopingsupport beam hooks 210 can be configured to hook onto the lip of rim ofthe liquid-holding vessel, thus suspending the propulsion heater at orabove the water line of the liquid-holding vessel. In some embodiments,the telescoping support beams 208 can be configured with pivoting jointsat the base where a beam meets the electronics housing 204 allowing asupport beam 208 to pivot up or down relative to the suspendedpropulsion heater 200. In some embodiments, the telescoping supportbeams 208 allow the propulsion heater to be suspended from an opening ofa liquid-holding vessel such that, for example, the sensor pillar 106,heater pillars 104 a-d, heater base 102, and mixing element 108 areimmersed in the liquid content of a liquid-holding vessel while theelectronics housing 204 can remain partially submerged or completelyabove the liquid in the liquid vessel.

FIG. 7 shows a schematic top plan view of the suspended propulsionheater 200 configured on a vessel 216. FIG. 7 shows the suspendedpropulsion heater 200 comprising four telescoping support beams 208 andhooks 210, the hooks 210 attached around a rim of a top of the vessel216.

FIG. 8 shows a schematic perspective view of a submergible propulsionheater 250 configured to be portable and submergible in a liquid forheating the liquid.

The submergible propulsion heater 250 can be configured with at leastone telescoping insulated arm 252 that can stand erect from andperpendicular to a heater base 254. The telescoping insulated arm 252can simplify placement of the submergible propulsion heater 250 in asubmerged position within a liquid of a liquid holding volume of avessel 256 by a user. In some embodiments, the telescoping insulated arm252 can be configured to comprise a perpendicularly attached insulatedhandle 258. By handling the submergible propulsion heater 250 with theinsulated handle 258, a user can more easily and accurately extend thetelescoping insulated arm 252 and position, reposition, and place thesubmergible propulsion heater 250 at a desired submerged position in aliquid of a liquid holding volume of the vessel 256. In someembodiments, as shown in FIG. 8 , the insulated handle 258 can beconfigured to include a button 260 and a status display 262. In someembodiments, the handle 258, telescoping insulated arm 252, and anelectronics housing 264 can also be configured with a hollow, waterproofrouting tunnel (not shown) through which power wiring (not shown) froman external power source (not shown), such as a DC power supply, can berouted into the submergible propulsion heater 250. The submergiblepropulsion heater 250 can be configured to comprise the mixing element108, the sensor pillar 106, the heater pillars 104 a-d, the mixer motor(not shown), and the volume sensor (not shown), among other components.

FIG. 9 is the computing device 300 suitable for certain components ofthe propulsion heater in FIGS. 1-8 . In a very basic configuration 302,the computing device 300 can include one or more processors 304 and asystem memory 306. A memory bus 308 can be used for communicatingbetween processor 304 and system memory 306.

Depending on the desired configuration, the processor 304 can be of anytype including but not limited to a microprocessor (μP), amicrocontroller (μC), a digital signal processor (DSP), or anycombination thereof. The processor 304 can include one more levels ofcaching, such as a level-one cache 310 and a level-two cache 312, aprocessor core 314, and registers 316. An example processor core 314 caninclude an arithmetic logic unit (ALU), a floating point unit (FPU), adigital signal processing core (DSP Core), or any combination thereof.An example memory controller 318 can also be used with processor 304, orin some implementations memory controller 318 can be an internal part ofprocessor 304.

Depending on the desired configuration, the system memory 306 can be ofany type including but not limited to volatile memory (such as RAM),non-volatile memory (such as ROM, flash memory, etc.) or any combinationthereof. The system memory 306 can include an operating system 320, oneor more applications 322, and program data 324.

The computing device 300 can have additional features or functionality,and additional interfaces to facilitate communications between basicconfiguration 302 and any other devices and interfaces. For example, abus/interface controller 330 can be used to facilitate communicationsbetween the basic configuration 302 and one or more data storage devices332 via a storage interface bus 334. The data storage devices 332 can beremovable storage devices 336, non-removable storage devices 338, or acombination thereof. Examples of removable storage and non-removablestorage devices include magnetic disk devices such as flexible diskdrives and hard-disk drives (HDD), optical disk drives such as compactdisk (CD) drives or digital versatile disk (DVD) drives, solid statedrives (SSD), and tape drives to name a few. Example computer storagemedia can include volatile and nonvolatile, removable and non-removablemedia implemented in any method or technology for storage ofinformation, such as computer readable instructions, data structures,program modules, or other data. The term “computer readable storagemedia” or “computer readable storage device” excludes propagated signalsand communication media.

The system memory 306, removable storage devices 336, and non-removablestorage devices 338 are examples of computer readable storage media.Computer readable storage media include, but are not limited to, RAM,ROM, EEPROM, flash memory or other memory technology, CD-ROM, digitalversatile disks (DVD) or other optical storage, magnetic cassettes,magnetic tape, magnetic disk storage or other magnetic storage devices,or any other media which can be used to store the desired informationand which can be accessed by computing device 300. Any such computerreadable storage media can be a part of computing device 300. The term“computer readable storage medium” excludes propagated signals andcommunication media.

The computing device 300 can also include an interface bus 340 forfacilitating communication from various interface devices (e.g., outputdevices 342, peripheral interfaces 344, and communication devices 346)to the basic configuration 302 via bus/interface controller 330. Exampleoutput devices 342 include a graphics processing unit 348 and an audioprocessing unit 350, which can be configured to communicate to variousexternal devices such as a display or speakers via one or more A/V ports352. Example peripheral interfaces 344 include a serial interfacecontroller 354 or a parallel interface controller 356, which can beconfigured to communicate with external devices such as input devices(e.g., keyboard, mouse, pen, voice input device, touch input device,etc.) or other peripheral devices (e.g., printer, scanner, etc.) via oneor more I/O ports 358. An example communication device 346 includes anetwork controller 360, which can be arranged to facilitatecommunications with one or more other computing devices 362 over anetwork communication link via one or more communication ports 364.

The network communication link can be one example of a communicationmedia. Communication media can typically be embodied by computerreadable instructions, data structures, program modules, or other datain a modulated data signal, such as a carrier wave or other transportmechanism, and can include any information delivery media. A “modulateddata signal” can be a signal that has one or more of its characteristicsset or changed in such a manner as to encode information in the signal.By way of example, and not limitation, communication media can includewired media such as a wired network or direct-wired connection, andwireless media such as acoustic, radio frequency (RF), microwave,infrared (IR) and other wireless media. The term computer readable mediaas used herein can include both storage media and communication media.

The computing device 300 can be implemented as a portion of a small-formfactor portable (or mobile) electronic device such as a cell phone, apersonal data assistant (PDA), a personal media player device, awireless web-watch device, a personal headset device, an applicationspecific device, or a hybrid device that include any of the abovefunctions. The computing device 300 can also be implemented as apersonal computer including both laptop computer and non-laptop computerconfigurations.

Specific embodiments of the technology have been described above forpurposes of illustration. However, various modifications can be madewithout deviating from the foregoing disclosure. In addition, many ofthe elements of one embodiment can be combined with other embodiments inaddition to or in lieu of the elements of the other embodiments.Accordingly, the technology is not limited except as by the appendedclaims. Furthermore, even if not labeled as such, Figures may not bedrawn to scale.

I claim:
 1. A heating apparatus comprising: a base; at least two heaterpillars extending from the base to a pillar height, wherein the at leasttwo heater pillars each comprise a heating element; a thermal sensor;and a mixer component, the mixer component comprising a mixing elementdisposed on the base between the base and the pillar height.
 2. Theapparatus of claim 1, wherein the heating element of each of the atleast two heater pillars comprises a resistive wire coil.
 3. Theapparatus of claim 2, wherein the resistive wire coil is encased in anelectrically insulative, thermally conductive compound.
 4. The apparatusof claim 1, wherein: the base comprises a top surface and a bottomsurface, the bottom surface of the base opposite the top surface of thebase, the at least two heater pillars extend from the top surface of thebase to the pillar height, the mixer component comprises a motor at thebottom surface of the base, and the mixing element is configured on thetop surface of the base.
 5. The apparatus of claim 4, wherein: the mixercomponent comprises a motor magnet, the mixing element comprises amixing magnet, and the mixing element is magnetically secured on the topsurface of the base via magnetic force between the motor magnet and themixing magnet.
 6. The apparatus of claim 1, wherein the base furthercomprises a volume sensor disposed on the base.
 7. The apparatus ofclaim 1, further comprising a thermal sensor pillar extending from thebase to a thermal sensor pillar height, wherein the thermal sensorpillar includes the thermal sensor.
 8. The apparatus of claim 7,wherein: the thermal sensor is a first thermal sensor, the thermalsensor pillar comprises at least one second thermal sensor, and thefirst and second thermal sensors are configured at different heights onthe thermal sensor pillar relative to the base.
 9. The apparatus ofclaim 1, further comprising a processor and a memory, the processorconfigured to execute instructions stored in the memory, the memorycomprising instructions including: measuring, with the thermal sensor, atemperature; determining that the temperature is below a targettemperature; and powering, using a power source, the heating elements ofthe at least two heater pillars.
 10. A heater configured to heat aliquid, the heater comprising: a base having a liquid-facing side; aheater pillar configured extending away from the base on theliquid-facing side of the base, the heater pillar comprising a heatingelement configured to generate heat when a voltage is applied across theheating element; a thermal sensor configured to detect a temperature;and a mixing element configured on the liquid-facing side of the base,the mixing element configured to agitate a liquid.
 11. The heater ofclaim 10, further comprising a thermal sensor pillar configuredextending away from the base on the liquid-facing side of the base, thethermal sensor pillar comprising the thermal sensor.
 12. The heater ofclaim 11, wherein the thermal sensor is a first thermal sensor, andwherein the thermal sensor pillar comprises a second thermal sensor. 13.The heater of claim 10, further comprising a mixing motor, wherein themixing motor is configured to cause the mixing element to agitate theliquid when the mixing motor is powered by a power source.
 14. Theheater of claim 13, wherein the mixing motor comprises a motor magnet,wherein the mixing element comprises a mixing magnet, wherein the mixingmotor is configured to cause the mixing element to agitate the liquidwhen the mixing motor is powered by a power source by the motor magnetrotating, causing the mixing element to rotate via magnetic force fromthe motor magnet.
 15. The heater of claim 10, wherein: the heater pillaris a first heater pillar and the heating element is a first heatingelement, and the heater further comprises a second heater pillarconfigured extending away from the base on the liquid-facing side of thebase, the second heater pillar comprising a second heating elementconfigured to generate heat when a voltage is applied across the secondheating element.
 16. The heater of claim 15, further comprising: a thirdheater pillar and a fourth heater pillar, the third heater pillar andthe fourth heater pillar extending away from the base on theliquid-facing side of the base, the third heater pillar and the fourthheater pillar comprising a third heating element and a fourth heatingelement, respectively, wherein the sensor pillar and the first, second,third, and fourth heater pillars are arranged equidistant apart on thebase.
 17. A heater comprising: a base; at least two heater pillarsconfigured on the base, the at least two heater pillars each comprisinga heating element configured to generate heat when powered; a thermalsensor; a power supply configured to power the heating elements of theat least two heater pillars; a memory storing computer-executableinstructions; and a processor configured to execute thecomputer-executable instructions stored in the memory, where theinstructions include: sensing, using the thermal sensor, a firsttemperature; comparing the first temperature with a target temperature;and powering, by the power supply, the heating elements of the at leasttwo heater pillars when the first temperature is less than the targettemperature.
 18. The heater of claim 17, further comprising a mixingcomponent; wherein, the mixing component comprises a mixing motor and amixing element, the mixing element is configured to rotate when power isapplied to the mixing motor, and the instructions further includepowering, by the power supply, the mixing motor while the heatingelements of the at least two heater pillars are powered.
 19. The heaterof claim 18, further comprising a sensor pillar comprising the thermalsensor.
 20. The heater of claim 19, wherein the mixing element isconfigured in a center of the at least two heater pillars and the sensorpillar.